Lanrui P08 High-Temperature Explosion-Proof Solder Tin Gasket

PKR 500.00

Lanrui P08 explosion-proof heat-resistant glass solder tin gasket prevents splatter and uneven solder balls during PCB and mobile repair soldering.

Overview
The Lanrui P08 High-Temperature Resistant Explosion-Proof Solder Tin Gasket Glass is a specialized soldering accessory designed for technicians performing BGA, IC, and PCB tin plating operations. Made from impact-resistant, heat-resistant ultra-clear glass, this tiny gasket (commonly 20×20 mm) provides a protective barrier that prevents solder splatter, bursting, and uneven solder balls caused by pad oxidation or stencil protrusion when using hot air stations or reflow processes. Its transparency allows visual monitoring of solder flow while enhancing safety and soldering accuracy.

Key Features

• Explosion-proof ultra-clear glass construction resists high temperatures.

• Prevents solder splatter and bursting during tin plating and rework.

• High impact resistance minimizes cracking or deformation under heat.

• Keeps steel reballing meshes flat and stable for precise soldering.

• Compact size (~20×20 mm) fits typical PCB rework setups.

• Transparent surface for clear visibility of soldering process.

Benefits

• Reduces soldering defects such as splatter and uneven tin deposits.

• Enhances workplace safety by containing hot solder particles.

• Improves repeatability and precision in fine SMT and BGA work.

• Transparent glass enables real-time process observation.

• Durable and reusable for workshop soldering tasks.

Applications

• Mobile phone motherboard soldering and tin plating.

• BGA chip reballing and IC rework.

• Soldering with hot air guns or reflow stations.

• Fine-pitch PCB surface-mount component solder work.

• Soldering tasks requiring reduced splatter and controlled conditions.

Compatible Models
Universal soldering accessory compatible with a wide range of PCBs, mobile devices, and electronics repair setups where localized tin plating and anti-splash control is needed.

FAQ Section

1. What is the Lanrui P08 solder tin gasket used for?
It provides a protective glass barrier to reduce solder splatter and bursting during PCB soldering.

2. Why is it described as explosion-proof?
The explosion-proof design resists sudden solder splashing caused by pad or stencil issues under heat.

3. What material is this gasket made of?
Impact- and heat-resistant ultra-clear glass suitable for high-temperature solder operations.

4. Can it withstand high soldering temperatures?
Yes — the glass resists the extreme heat typical in hot-air and reflow soldering.

5. How does it improve soldering results?
It stabilizes solder flow, reduces splatter, and allows technicians to monitor soldering with minimal defects.