JTX T4 Pro Reballing Platform – CPU, EMMC IC Repair Clamp with 14 BGA Stencils - BilalGSM Pakistan PCB Holder
PKR 7500.00
Buy the JTX T4 Pro Chip Glue Removal/Reballing Platform with 14 BGA Stencils for iPhone and Android CPU, EMMC IC repairs. Available at the best price in Pakistan at BilalGSM.
Overview
The JTX T4 Pro Chip Glue Removal/Reballing Platform is a professional-grade tool designed for precise CPU, EMMC, and IC repairs on iPhones and Android phones. Equipped with 14 BGA stencils, this platform offers unparalleled efficiency in glue removal, reballing, and chip repairs. Its robust design ensures durability and precision, making it ideal for repair professionals.
Key Features
Multifunctional Platform: Supports glue removal, chip reballing, and IC repairs.
14 BGA Stencils Included: Covers a wide range of chip sizes for compatibility with various devices.
High Precision Clamping: Ensures stable and accurate positioning during repairs.
Durable Construction: Made from high-quality materials for long-term use.
Wide Compatibility: Suitable for iPhone, Android devices, and other electronic components.
Heat-resistant Design: Withstands high temperatures during soldering and reballing processes.