Louwei LW-SP1 217° high quality solder paste

PKR 1400.00

LW-SP1 217°C BGA solder paste flux designed for IC soldering and reballing on smartphone and electronic PCBs with controlled melting.

Overview
LW-SP1 is a high-quality BGA solder paste flux with a controlled melting point of 217°C, designed for precision IC soldering and reballing work. It provides stable flow during heating, helping technicians achieve clean solder joints on smartphone motherboards and other fine-pitch PCBs.

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Key Features

• 217°C melting point for controlled solder flow

• Designed for BGA and SMT soldering tasks

• Suitable for IC soldering and reballing processes

• Smooth paste consistency for accurate application

• Supports fine-pitch PCB and motherboard work

• Stable performance under hot air and rework stations

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Benefits

• Improves solder joint consistency

• Reduces solder bridging on fine pads

• Enhances control during IC installation

• Supports cleaner reballing and reflow results

• Helps maintain PCB and pad integrity

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Applications

• BGA IC soldering on smartphone motherboards

• IC reballing and reinstallation

• SMT component soldering

• Chipset repair and replacement

• Precision PCB soldering tasks

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FAQ Section

1. What does LW-SP1 solder paste do?
It melts at 217°C to form solder joints during BGA and IC soldering.

2. What common repair issues is it used for?
Weak joints, reballing failures, and IC soldering inconsistencies.

3. Is it suitable for smartphone repairs?
Yes, it is designed for fine-pitch smartphone motherboards.

4. What skill level is required to use it?
Basic to professional micro-soldering experience is recommended.

5. What repair outcome does it help achieve?
More stable and uniform solder joints on ICs and PCBs.