MECHANIC XGSP-50 183°C Solder Paste Flux for BGA SMD Mobile Repair Best Price in Pakistan BilalGSM BGA SOLDERING FLUCKS AND BGA PASTE

PKR 850.00

Buy MECHANIC XGSP-50 183°C solder paste flux, ideal for BGA SMD welding and mobile phone repair. Ensures strong solder joints and smooth application. Available at the best price in Pakistan from BilalGSM.

Overview

The MECHANIC XGSP-50 Solder Paste Flux is a high-performance lead-based soldering paste designed for BGA SMD welding and mobile phone repair. With a 183°C melting point, it provides strong adhesion, excellent conductivity, and smooth application, making it a must-have for professional technicians and DIY repairs.

Key Features

• High-quality XGSP-50 solder paste for mobile phone repair
• 183°C melting point for stable and precise soldering
• Ideal for BGA SMD welding and circuit board work
• Provides excellent adhesion and conductivity
• Easy-to-apply formula for professional results

Benefits

• Ensures strong and durable solder joints
• Reduces oxidation for a cleaner soldering process
• Enhances electrical conductivity for stable connections
• Minimizes soldering defects like cold joints and bridging
• Perfect for professional repair shops and DIY electronics enthusiasts

Applications

• BGA and SMD component soldering
• Mobile phone motherboard and chip repairs
• Laptop and small electronic device maintenance
• Precision circuit board rework