UAPU1-U3 PLATE WITH STENCIL MAGNET Amaoe

PKR 2000.00

AMAOE U-APU1, U-APU2, and U-APU3 CPU BGA reballing stencils with positioning plate for precise smartphone motherboard repair.

Overview

AMAOE U-APU1 to U3 Stencil with Positioning Plate includes three individual CPU BGA reballing stencils (U-APU1, U-APU2, and U-APU3) supplied together in one listing. Each stencil corresponds to its specific CPU layout pattern. The included positioning plate assists with accurate chip alignment during solder ball placement and heating. This configuration supports controlled and repeatable CPU reballing workflows in professional smartphone motherboard repair.

Key Features

• Includes three separate stencil patterns: U-APU1, U-APU2, U-APU3

• Dedicated layout for matching CPU designs

• Supplied with positioning plate for chip alignment

• Precision-etched BGA grid structure

• Heat-resistant metal construction

• Designed for hot air rework processes

Benefits

• Allows coverage of multiple CPU layouts in one repair setup

• Improves alignment accuracy during solder ball placement

• Reduces risk of solder bridging and misalignment

• Enhances consistency in CPU reballing procedures

• Suitable for professional board-level repair workflows

Applications

• CPU reballing

• BGA solder ball replacement

• Smartphone motherboard repair

• IC restoration and reinstallation

• Controlled hot air rework processes

Compatible Models

Compatible with CPU chips matching U-APU1, U-APU2, and U-APU3 stencil patterns. Chip layout verification is required before use.

FAQ Section

1. What does this product include?
It includes three separate CPU stencils (U-APU1, U-APU2, U-APU3) and one positioning plate.

2. Are these interchangeable stencil patterns?
No, each stencil matches its specific CPU layout pattern.

3. When do technicians use the positioning plate?
During solder ball placement to maintain correct chip alignment.

4. Is this suitable for beginner technicians?
CPU BGA reballing requires professional micro-soldering experience.

5. How does this improve repair results?
It supports accurate solder ball distribution and stable CPU alignment during reinstallation.