Buy Amaoe LPDDR1 BGA Reballing Stencil for BGA134, BGA200, BGA60, BGA168, BGA178, BGA136 at Best Price - BilalGsm Pakistan BGA STENCIL

PKR 1200.00

Shop for the Amaoe LPDDR1 BGA Reballing Stencil for BGA chips like BGA134, BGA200, BGA60, BGA168, and more at BilalGsm Pakistan. Ideal for LPDDR RAM, EMMC, NAND Flash chip soldering. Get the best price now!

Overview of the Amaoe LPDDR1 BGA Reballing Stencil

The Amaoe LPDDR1 BGA Reballing Stencil is specifically designed to help technicians replace solder balls on BGA packages used in smartphones, tablets, and other electronic devices. By using this stencil, technicians can reflow or reball the BGA chips with new solder balls, ensuring proper electrical contact between the chip and the PCB (Printed Circuit Board). The stencil supports various BGA sizes and chip types, making it ideal for LPDDR RAM, EMMC, NAND Flash, and other chips commonly found in modern mobile devices.

Key Features of Amaoe LPDDR1 BGA Reballing Stencil

1. Multi-Size Compatibility:

   • Designed for a wide range of BGA sizes, including BGA134, BGA200, BGA60, BGA168, BGA178, BGA136, making it versatile for various mobile device repairs.

2. Precision Engineering:

   • Manufactured with high-quality stainless steel, ensuring the stencil maintains its shape and accuracy even after repeated use. This provides consistent results and helps avoid misalignment during the reballing process.

3. Wide Application Range:

   • Supports a variety of LPDDR RAM, EMMC, and NAND Flash chips used in smartphones, tablets, laptops, and other devices.

4. Durability and Longevity:

   • The stencil is highly durable, designed to withstand high temperatures during the soldering process, ensuring that it lasts for many rework sessions without warping or degradation.

5. Enhanced Reballing Efficiency:

   • Provides perfectly spaced and precise holes for reballing, ensuring the solder balls are correctly placed without any issues, leading to higher-quality repairs.

6. Improved Heat Resistance:

   • Capable of withstanding high-temperature environments during the reflow soldering process, which ensures no warping or damage to the stencil over time.

7. User-Friendly:

   • Easy to use for both beginner and professional technicians, reducing the likelihood of errors during the reballing process.

Benefits of Using Amaoe LPDDR1 BGA Reballing Stencil

1. Cost-Effective Repairs:

   • Reballing is a cost-effective alternative to replacing damaged chips, allowing technicians to save on parts while ensuring the device is repaired to a high standard.

2. Improved Chip Longevity:

   • Reballing chips with a properly aligned stencil ensures better electrical contact, which can help extend the lifespan of the chip and improve device performance.

3. Enhanced Repair Precision:

   • By using this stencil, technicians can achieve greater accuracy in solder ball placement, ensuring a smooth and reliable repair process.

4. Increased Efficiency:

   • The stencil aids in the quick and accurate placement of solder balls, making the repair process faster and reducing the likelihood of mistakes.

5. Universal Compatibility:

   • With support for multiple chip sizes (including LPDDR RAM, EMMC, and NAND Flash), this stencil is versatile and can be used across a range of devices.

6. Durable and Reusable:

   • Designed for long-term use, the stencil is made of high-quality stainless steel, ensuring it remains reliable even after many reballing sessions.

Applications of Amaoe LPDDR1 BGA Reballing Stencil

1. Mobile Device Repair:

   • iPhone, Samsung, Huawei, and other smartphones often use LPDDR RAM, EMMC, and NAND Flash chips, which can be reballing using this stencil for faulty or damaged chips.

2. Tablet and Laptop Repairs:

   • For tablets and laptops that use LPDDR RAM or EMMC chips, the Amaoe BGA stencil is ideal for reballing to ensure optimal performance after repairs.

3. Memory and NAND Flash Repair:

   • Used in the repair of memory chips like LPDDR RAM, EMMC, and NAND Flash chips in devices such as data recovery systems, storage devices, and memory-related components.

4. Rework & Service Centers:

   • A critical tool in repair shops and service centers that specialize in BGA rework, chip-level repairs, and soldering work for mobile and consumer electronics.

5. Data Recovery:

   • When EMMC or NAND Flash chips are physically damaged, this stencil can be used to reball them to restore data access or facilitate repairs.

6. Electronics Manufacturing & Quality Control:

   • In electronics assembly, reballing stencils are used for quality control or during the manufacturing process to ensure perfect soldering of components on a BGA package.

Where to Buy Amaoe LPDDR1 BGA Reballing Stencil at Best Price in Pakistan

The Amaoe LPDDR1 BGA Reballing Stencil is available at BilalGsm in Pakistan at the best price. You can get this high-quality reballing tool for your mobile repair shop or electronics service center by visiting BilalGsm or contacting their customer service for more details on pricing, availability, and shipping.

• Website: Visit BilalGsm's official site for more details on the stencil, including the latest prices and offers.