JTX SM‑01 Swap Board for iPhone 8 to 16 Pro Max – BGA Reballing Platform Tool
PKR 11000.00
Buy JTX SM‑01 Swap Board for iPhone 8 to 16 Pro Max. Magnetic base, BGA reballing platform for CPU, NAND, and chip swapping. Ideal for logic board repair.
Product Overview
The JTX SM‑01 Swap Board for iPhone 8 to 16 Pro Max is a professional BGA reballing and chip swapping platform designed specifically for mobile motherboard repair. With magnetic positioning, precision metal stencil plates, and support for all iPhone 8–16 series models, this board makes CPU, NAND, and baseband chip replacement faster and more accurate. Whether you're an experienced technician or a repair business owner, this tool boosts your workflow with confidence.
Key Features
Full support for iPhone 8 to 16 Pro Max models
Magnetic base and metal stencil plates ensure exact chip alignment
High-temperature resistance for safe hot air reballing
Made with durable anti-slip stone material
Includes multiple positioning plates for various motherboard types
Easy-to-use fixture for CPU, NAND, EEPROM, baseband IC swapping
Compact and repair-lab friendly design
Benefits
Reduces chip misalignment errors during reballing and rework
Improves efficiency and accuracy in chip-level mobile phone repair
Saves time on logic board component replacement
Works with standard hot air or reflow stations
Durable construction allows repeated use without warping
Ideal for repair centers, refurbishing facilities, and technicians
Applications
Used for chip swapping and reballing on iPhone motherboards
Perfect for CPU, NAND, and baseband rework in high-precision repair
Recommended for professional phone repair shops
Compatible with iPhone 8 to 16 Pro Max logic boards