LW-SP1 199° HIGH QUALITY SOLDER PASTE BGA SOLDERING FLUCKS AND BGA PASTE

PKR 1400.00

LW-SP1 is a professional low-temperature BGA solder paste flux with a melting point of 199°C, engineered for precision IC soldering and reballing tasks. It ensures smooth solder flow and reliable joint formation, reducing the risk of PCB damage while enabling high-quality micro-soldering repairs.

Key Features

• 199°C controlled melting point for low-temperature soldering

• Suitable for BGA and SMT IC soldering

• Smooth paste consistency for precise application

• Supports fine-pitch motherboards and smartphone PCBs

• Stable performance with hot air rework and soldering stations

• Ideal for reballing and IC replacement

Benefits

• Produces consistent and strong solder joints

• Reduces bridging and solder defects on fine pads

• Enhances control during IC installation and reflow

• Protects PCB and component integrity

• Improves efficiency in micro-soldering tasks

Applications

• BGA IC soldering on smartphone motherboards

• IC reballing and component replacement

• SMT PCB repair and reflow

• Chipset and logic IC repair

• Precision micro-soldering on fine-pitch boards

Compatible Models
Compatible with multiple smartphone motherboards and electronic PCBs requiring low-temperature BGA soldering.

FAQ Section

1. What does LW-SP1 199°C solder paste do?
It melts at 199°C to form precise solder joints for BGA and IC components.

2. What common repair issues is it used for?
Weak solder joints, bridging, or reballing challenges on fine-pitch ICs.

3. Is it suitable for smartphone motherboard repairs?
Yes, it is optimized for smartphone and small electronic PCBs.

4. What skill level is required to use it?
Technicians with basic to professional micro-soldering experience can use it.

5. What repair outcome does it improve?
Stable, uniform, and reliable solder joints on ICs and BGA components.