LW-SP1 183° HIGH QUALITY SOLDER PASTE

PKR 1200.00

LW-SP1 183°C BGA solder paste flux for low-temperature IC soldering and reballing on smartphone motherboards and fine-pitch PCBs.

Overview
LW-SP1 183°C is a high-quality, ultra-low temperature BGA solder paste flux designed for precise IC soldering and reballing. Its low melting point minimizes heat stress on delicate PCBs and components, allowing technicians to perform fine-pitch micro-soldering with improved control and consistent solder joint formation.

Key Features

• 183°C ultra-low melting point for sensitive PCBs

• Ideal for BGA and SMT IC soldering

• Smooth, controlled paste consistency for accurate application

• Supports fine-pitch smartphone motherboards and electronics

• Reliable performance with hot air rework and soldering stations

• Perfect for reballing and IC replacement on delicate circuits

Benefits

• Reduces risk of PCB and component heat damage

• Ensures consistent, clean solder joints

• Minimizes bridging and soldering errors on fine pads

• Enhances precision during IC placement and reflow

• Increases efficiency in professional micro-soldering repair

Applications

• Low-temperature BGA IC soldering on smartphone motherboards

• IC reballing and replacement

• SMT PCB repair and fine-pitch component soldering

• Chipset repair and delicate IC rework

• Micro-soldering tasks requiring minimal thermal stress

Compatible Models
Compatible with multiple smartphone motherboards and fine-pitch electronic PCBs.

FAQ Section

1. What does LW-SP1 183°C solder paste do?
It melts at 183°C to create low-temperature solder joints for BGA and IC components.

2. What common repair problems is it used for?
Bridging, weak solder joints, and damage-prone IC soldering.

3. Is it suitable for smartphone repairs?
Yes, especially for delicate motherboards and fine-pitch ICs.

4. What skill level is required to use it?
Basic to professional micro-soldering experience is recommended.

5. What repair outcome does it improve?
Stable, precise, and clean solder joints on sensitive ICs and BGA chips.