HJ-35 Hidden Pure Plane 3D Fixture (for Chips)

PKR 4000.00

Buy HJ-35 hidden pure plane 3D fixture for mobile phone chip soldering, alignment, and BGA reballing repair work.

Overview:

The HJ-35 Hidden Pure Plane 3D Fixture is a precision chip-holding tool designed for mobile phone IC soldering, reballing, and alignment tasks. It securely fixes individual chips in a perfectly flat plane, allowing accurate solder ball placement and stable heating during rework. This fixture is commonly used in advanced motherboard-level repairs for iPhone and Android devices.

Key Features:

• Hidden pure plane 3D chip fixation design

• Ensures perfectly flat chip positioning

• Heat-resistant structure for hot air rework

• Prevents chip movement during soldering

• Suitable for BGA, QFN, and small IC chips

• Precision-machined for accurate alignment

Benefits:

• Improves accuracy during IC reballing

• Reduces solder bridging and misalignment

• Protects chip pads from damage

• Enhances repeatability of chip repairs

• Essential tool for board-level repair technicians

Applications:

• BGA IC reballing and solder ball placement

• Chip soldering and desoldering operations

• Power IC, charging IC, audio IC chip handling

• CPU, baseband, and controller IC repairs

• Advanced motherboard-level chip rework

Compatible Models:

• iPhone IC chips

• Android smartphone IC chips

• Chips used on mobile phone motherboards

FAQ Section:

Q1: What is the HJ-35 fixture used for?
It is used to securely hold IC chips during soldering, reballing, and alignment processes.

Q2: What does “hidden pure plane” mean?
It ensures the chip sits perfectly flat, allowing even solder ball contact and accurate alignment.

Q3: Can it be used with hot air stations?
Yes. The fixture is heat resistant and suitable for hot air rework.

Q4: Is it compatible with different chip sizes?
Yes. It supports a wide range of mobile phone IC chip sizes.

Q5: Is this tool suitable for beginners?
It is recommended for technicians with chip-level repair experience.