LW-SP1 158° HIGH QUALITY SOLDER PASTE

PKR 1400.00

LW-SP1 158°C BGA solder paste flux for ultra-low temperature IC soldering and reballing on smartphone motherboards and fine-pitch PCBs.

Overview
LW-SP1 158°C is an ultra-low temperature, high-quality BGA solder paste flux designed for precise IC soldering and reballing on sensitive PCBs. Its extremely low melting point reduces thermal stress, protecting delicate components and boards while allowing technicians to perform accurate micro-soldering with minimal risk.

Key Features

• 158°C ultra-low melting point for heat-sensitive PCBs

• Suitable for BGA and SMT IC soldering

• Smooth paste consistency for precise application

• Designed for fine-pitch smartphone motherboards and electronics

• Stable performance with hot air rework and soldering stations

• Ideal for reballing, IC replacement, and delicate soldering tasks

Benefits

• Minimizes risk of PCB and component damage due to heat

• Provides consistent, high-quality solder joints

• Reduces bridging and soldering defects on fine pads

• Enhances precision during IC placement and reflow

• Improves efficiency in micro-soldering and delicate repairs

Applications

• Ultra-low temperature BGA IC soldering

• IC reballing and replacement on delicate motherboards

• Fine-pitch SMT PCB repairs

• Chipset and logic IC micro-soldering

• Sensitive electronics and micro-component repair

Compatible Models
Compatible with multiple smartphone motherboards and fine-pitch electronic PCBs requiring ultra-low temperature soldering.

FAQ Section

1. What does LW-SP1 158°C solder paste do?
It melts at 158°C to create low-temperature solder joints for BGA and IC components.

2. What common repair issues is it used for?
Delicate IC soldering, weak joints, and bridging problems.

3. Is it suitable for smartphone repairs?
Yes, especially for sensitive motherboards and fine-pitch ICs.

4. What skill level is required to use it?
Technicians with basic to advanced micro-soldering experience can use it.

5. What repair outcome does it improve?
Safe, precise, and clean solder joints on heat-sensitive ICs and BGA chips.