Amaoe 6-in-1 EMMC EMCP UFS BGA153-254 Reballing Stencil Kit(with magnet base) for Phone MTK LCD TV NAND Repair

PKR 7500.00

Buy Amaoe 6-in-1 Reballing Stencil Kit for EMMC EMCP UFS NAND ICs. Supports BGA153/162/169/186/221/254 chip sizes. Perfect for phone, MTK, and LCD TV motherboard soldering repair.

Overview

The Amaoe 6-in-1 Reballing Stencil Kit is a professional repair tool designed for EMMC, EMCP, and UFS NAND chips. It includes six high-precision stencils compatible with BGA153, BGA162, BGA169, BGA186, BGA221, and BGA254 chip sizes. Built from durable high-temperature stainless steel, it ensures accurate solder ball alignment, making it essential for mobile phone, MTK boards, LCD TV mainboards, and NAND flash repair.

Key Features

• 6-in-1 stencil kit: Supports BGA153, 162, 169, 186, 221, and 254 chip formats.

• Durable material: Made of 0.15 mm stainless steel mesh, strong and heat resistant.

• Precision holes: Ensures clean solder ball placement without misalignment.

• Ventilation design: Prevents solder bulging and warping during reflow.

• Universal compatibility: Works with mobile NAND, MTK processors, LCD TVs, and IC reballing stations.

Benefits

• Cost-effective: One kit covers six chip formats, reducing the need for multiple stencils.

• Professional results: Provides accurate reballing for long-lasting chip repair.

• Time-saving: Easy alignment speeds up NAND/IC rework.

• Reusable & durable: Long service life for workshops and technicians.

• Versatile use: Suitable for phones, tablets, smart TVs, laptops, and motherboard repairs.

Applications

• Reballing EMMC, EMCP, and UFS NAND chips on smartphones (Android & iPhone).

• Repairing MTK phone motherboards and power ICs.

• Reballing and replacing chips on LCD TV boards.

• Professional use in repair labs, service centers, and DIY workshops.

• Amaoe 6 in 1 reballing stencil kit

• EMMC EMCP UFS BGA stencil for phone repair

• NAND flash reballing tool for MTK and TV

• BGA153 162 169 186 221 254 reballing stencil kit