LUOWEI LW-2015 Desoldering Wick 2.0mm x 1.5m – Tin Absorbing Wire for BGA PCB Repair
PKR 400.00
Buy LUOWEI LW-2015 Desoldering Wick (2.0mm x 1.5m) online. Strong tin absorbing copper wire for BGA rework, mobile PCB cleaning, and solder removal. Anti-oxidation, clean, and fast.
Overview
The LUOWEI LW-2015 Desoldering Wick is a professional-grade tin absorbing wire designed for quick and efficient solder removal from mobile PCBs, BGA chips, and electronic circuits. Crafted from high-purity copper with anti-oxidation treatment, this 2.0mm wide, 1.5m long desoldering braid is perfect for technicians working on mobile phone, laptop, or microcontroller repairs.
Key Features
2.0mm width, ideal for BGA IC pads, mobile PCB tracks, and SMT components
1.5-meter long spool suitable for extended usage and technician workflows
Made of high-purity copper wire for excellent thermal conductivity
Strong tin absorption with low residue and clean desoldering
Anti-oxidation coated braid resists corrosion and maintains long shelf life
Soft and flexible design for use on delicate boards without damage
Benefits
Removes excess solder quickly and cleanly
Minimizes heat stress and prevents PCB pad lifting or damage
Boosts accuracy during BGA chip replacement or reballing
Ideal for rework, IC desoldering, and connector pad cleaning
Increases technician efficiency and reduces rework time
Applications
Mobile phone motherboard repairs (iPhone, Samsung, Vivo, Xiaomi, etc.)
BGA chip rework and solder pad cleanup
SMT component removal
Repairs in telecom boards, routers, game consoles, and laptops