LUOWEI LW-3015 Desoldering Wick 3.0mm x 1.5m – Tin Absorbing Wire for PCB & BGA Rework

PKR 500.00

Buy LUOWEI LW-3015 Desoldering Wick 3.0mm x 1.5m online. Strong tin absorbing copper braid for clean solder removal on PCB, BGA chips, and motherboard repair. Perfect for technicians.

Overview

The LUOWEI LW-3015 Desoldering Wick (3.0mm x 1.5m) is a high-performance tin absorbing copper braid designed for fast and efficient solder removal from electronic circuit boards. Perfect for BGA repair, mobile motherboard rework, and PCB cleaning, this desoldering wire offers excellent thermal conductivity and minimal residue, making it an essential tool for every technician’s workstation.

Key Features

• 3.0mm wide braid ideal for larger solder pads, BGA chips, and wide solder joints

• 1.5 meters long for extended, professional-grade use

• Made of pure copper with anti-oxidation coating for clean solder removal

• Fast heat transfer and strong tin absorption

• Leaves low residue and protects PCB from overheating or lifting pads

• Compatible with hot air rework stations and soldering irons

Benefits

• Speeds up BGA reballing and chip replacement tasks

• Reduces thermal damage to PCB tracks

• Ensures clean and precise pad preparation

• Perfect for mobile phone repairs, laptop motherboard work, and electronics servicing

• Helps in reducing rework and increasing repair efficiency

Applications

• Mobile phone logic board cleaning (Samsung, iPhone, Vivo, Oppo, Infinix, etc.)

• BGA IC and CPU desoldering and pad cleanup

• General PCB solder removal for laptop, smart TV, router, and IoT devices

• Used in repair labs, service centers, and electronics workshops

• luowei lw-3015 desoldering wick 3.0mm

• 3.0mm tin absorbing wire for BGA repair

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