Luowei LW-AP04 Aviation Tempered Glass Fixture for Android Motherboard Repair
PKR 5500.00
Buy the Luowei LW-AP04 tempered glass fixture for Android motherboard repair. Heat-resistant, stable, and compatible with 99% of phone boards. Perfect for IC reballing and chip-level repair.
Overview
The Luowei LW-AP04 Aviation Tempered Glass Fixture is a high-precision clamping tool built for Android motherboard repair. Crafted with durable aviation-grade tempered glass, this fixture ensures rock-solid stability during delicate operations like IC reballing, CPU swaps, or soldering. It supports over 99% of Android and irregular motherboard shapes, making it a must-have for mobile phone repair professionals.
Key Features
Tempered glass base resists high temperatures during soldering
Compatible with 99% of Android and iPhone boards
Multi-angle clamping system with precision-threaded supports
Scratch-resistant and corrosion-resistant finish
Lightweight yet stable structure
Designed for use with hot-air and BGA stations
Benefits
Prevents motherboard movement during sensitive repair procedures
Withstands intense heat during hot-air soldering
Increases repair accuracy and reduces chances of IC damage
Saves time by securely positioning complex board layouts
Ideal for both professional repair labs and DIY technicians
Applications
Mobile motherboard CPU/IC reballing and replacement
NAND and EEPROM IC repairs on Android and iPhone boards
Use in smartphone chip-level diagnostics and rework
Suitable for repair centers, refurbishment labs, and training institutes
Luowei LW-AP04 motherboard fixture
Aviation tempered glass fixture for Android repair