Luowei IS-20 IC Chip Soldering Tweezers for Tin Planting & BGA Stencil Repair – Super Hard PCB Tweezer

PKR 1000.00

Buy Luowei IS-20 IC chip soldering tweezers – super hard, precision tweezers for tin planting, BGA stencil, and PCB repair. Perfect for iPhone, Samsung, Xiaomi, Oppo motherboard rework.

Overview

The Luowei IS-20 IC Chip Soldering Tweezers are high-precision tweezers specifically designed for tin planting, IC handling, and BGA stencil alignment during circuit board repair. Crafted from industrial-grade super-hard steel, these tweezers provide stable, slip-free handling of tiny components — making them ideal for professional mobile phone motherboard repairs.

Whether you're a technician working on iPhone, Samsung, Oppo, Xiaomi, or VIVO devices, these tweezers ensure maximum control during soldering, reballing, or IC placement.

Key Features

• Made from super-hard stainless steel for extended durability

• Fine, anti-slip tips perfect for IC pins, BGA stencils, and tiny solder balls

• Designed for tin planting, IC alignment, and component extraction

• Heat-resistant and anti-magnetic for safe use around sensitive chips

• Lightweight and ergonomic grip for long repair sessions

Benefits

• Enables accurate tin line placement during BGA stencil work

• Reduces the risk of component shifting or damage

• Perfect for micro-soldering tasks and complex IC work

• Helps improve efficiency and speed in chip-level repairs

• Compatible with various mobile repair workstations and microscopes

Application

• Suitable for PCB circuit board repair

• Used in IC chip placement, solder ball alignment, and tin planting

• Works with BGA, SMD, QFN, and other micro components

• Ideal for mobile phone technicians, repair shops, and DIYers

• Luowei IS-20 IC chip soldering tweezers

• super hard tweezer for BGA stencil

• tin planting tweezer for circuit board repair

• PCB repair tool for IC and solder ball

• best tweezer for IC chip soldering mobile phones