Luowei IS-30 Motherboard Layered Tweezer for Mobile Chip Soldering & Frame Separation
PKR 2000.00
Buy Luowei IS-30 layered tweezer for mobile phone motherboard repair. Ideal for IC chip soldering, middle frame separation, and micro-layer alignment. Durable, anti-slip, and ESD-safe.
Product Name
Luowei IS-30 Motherboard Layered Tweezer for Mobile Chip Soldering and Frame Separation Tool
Overview
The Luowei IS-30 Motherboard Layered Tweezer is a premium, precision hand tool designed for chip-level soldering, middle frame separation, and motherboard layer positioning in mobile phone repair. Built for durability and performance, it’s ideal for technicians working on smartphones like iPhone, Samsung, Xiaomi, OPPO, and VIVO. The 35° angled tip ensures pinpoint accuracy during delicate operations on high-density PCB boards.
Key Features
35° precision angled tip for layered motherboard separation and IC positioning
Constructed with hardened stainless steel for long-lasting performance
Anti-slip grip for better control during micro-soldering
Compact, lightweight design for tight space accessibility
Heat-resistant and anti-magnetic coating for ESD-safe usage
Benefits
Ensures stable IC chip handling while soldering or reballing
Reduces component damage risk during frame separation
Perfect for multi-layered PCB repairs and tight repair areas
Boosts technician efficiency with enhanced grip and tip accuracy
Compatible with multiple motherboard types and mobile brands
Application
Middle frame separation in smartphones
Precise positioning of IC chips on mobile motherboard
Suitable for iPhone 8–15 series, Samsung A/M Series, Xiaomi, OPPO, VIVO, etc.
Excellent for BGA reballing, NAND removal, and logic board soldering