LUOWEI LW-PT01 iPhone X–15 Pro Max BGA Reballing Platform for Motherboard Layer Repair

PKR 16000.00

Buy LUOWEI LW-PT01 BGA Reballing Platform for iPhone X to 15 Pro Max. Precision magnetic stencil, heat-resistant base for motherboard tin planting and chip repair.

Overview

The LUOWEI LW-PT01 Middle Frame BGA Reballing Stencil Platform is a professional-grade reballing station designed for iPhone X to 15 Pro Max motherboard repairs. Built with precision engineering, it features heat-resistant composite material, ultra-fine alignment, and modular compatibility for seamless tin planting and layered rework. Whether you're handling CPU, NAND, or RAM replacement, this stencil platform delivers unmatched stability and accuracy.

Key Features

• Compatible with iPhone X to iPhone 15 Pro Max motherboard logic board series.

• Includes magnet base, 5 positioning plates, and 17 stencils for multi-model use.

• Crafted with high-strength composite material that resists heat and deformation.

• Features six magnetic points to ensure exact positioning without movement.

• Designed with side notches for easy board placement and removal.

• Supports multi-layer reballing and tin planting operations efficiently.

Benefits

• Save time with zero-error reballing alignment.

• Avoid board damage due to strong heat resistance and magnetic stability.

• Universal fit reduces need to buy different stencils for each iPhone model.

• Perfect for BGA soldering, IC replacement, and logic board repair.

• Ideal for professional technicians, repair shops, and refurbishing labs.

Application

• Used for tin planting, IC chip reballing, motherboard repair, and CPU/NAND replacement.

• Supports iPhone X, XR, XS, 11, 12, 13, 14, and 15 Pro Max logic boards.

• Compatible with BGA soldering stations, microscopes, and hot air tools.

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