PKR 20000.00
Buy Luowei HS3-PRO Motherboard Layered BGA Soldering Rework Station for iPhone X to iPhone 17 Pro Max at Best Price in Pakistan – BilalGSM
The Luowei HS3-PRO Motherboard Layered BGA Soldering Rework Station is a professional repair platform designed for precise soldering, reballing, and motherboard separation of iPhone devices from iPhone X through iPhone 17 Pro Max. Engineered for advanced motherboard-level repairs, the HS3-PRO provides stable positioning, accurate alignment, and efficient handling of layered logic boards, making it an essential tool for professional mobile repair technicians. Luowei is recognized for developing specialized mobile phone repair tools and workstations for microsoldering applications.
The Luowei HS3-PRO is specifically designed to support layered motherboard repair procedures commonly required in modern iPhone devices. Its precision-engineered platform helps technicians safely separate, align, solder, and reassemble stacked motherboards during CPU, NAND, power IC, Face ID, and charging IC repair operations. The robust construction ensures stability during high-precision BGA work while minimizing the risk of board damage.
Wide Compatibility: Supports iPhone X through iPhone 17 Pro Max motherboard repair.
Layered Motherboard Support: Designed for split-board and stacked motherboard soldering procedures.
High-Precision Alignment: Ensures accurate positioning during BGA rework and motherboard assembly.
Professional Rework Platform: Suitable for CPU, NAND, charging IC, power IC, and motherboard-level repairs.
Durable Construction: Built from high-quality materials for long-term workshop use.
Stable Working Platform: Helps reduce movement and improve repair accuracy during soldering operations.
Technician-Friendly Design: Optimized for professional microsoldering and advanced repair workflows.
Improves Repair Accuracy: Precise positioning minimizes alignment errors during motherboard repairs.
Saves Repair Time: Streamlines board separation, soldering, and reassembly processes.
Reduces Risk of Damage: Stable platform helps protect delicate motherboard components.
Supports Advanced Repairs: Ideal for complex iPhone logic board and BGA repair jobs.
Professional Results: Enables technicians to achieve consistent and reliable repair outcomes.
iPhone Motherboard Repair: Suitable for repairing layered and stacked logic boards.
BGA Rework Operations: Ideal for CPU, NAND, EEPROM, charging IC, and power IC replacement.
Mobile Repair Workshops: Essential tool for professional repair centers and technicians.
Microsoldering Projects: Designed for precision motherboard-level maintenance and troubleshooting.
Get the Luowei HS3-PRO Motherboard Layered BGA Soldering Rework Station for iPhone X to iPhone 17 Pro Max at the best price in Pakistan from BilalGSM, your trusted source for professional mobile phone repair tools and equipment.
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