LUOWEI LW-K1S 4-in-1 IC CPU Glue Removal Blade Set for Mobile Motherboard Repair

PKR 1500.00

Buy LUOWEI LW-K1S prying blade set for glue removal from IC, CPU, and mobile motherboards. 4-in-1 high-carbon steel tool for precise adhesive cleaning.

Overview

The LUOWEI LW-K1S Glue Removal Prying Blade Set is a 4-in-1 professional-grade toolset designed for precise removal of glue and adhesive from mobile phone and tablet motherboard ICs, CPUs, and logic boards. Made from high-carbon spring steel with vacuum plating, this set delivers the perfect balance of sharpness, flexibility, and durability—ideal for sensitive repair work without damaging components.

Key Features

• 4 Replaceable Blade Tips: Includes straight, curved, and fine-tip options for multi-angle use.

• High-Carbon Spring Steel: Offers superior toughness and edge retention.

• Vacuum Plated Finish: Rust-resistant and wear-proof for long-term performance.

• Polished Sharp Edges: Laser-finished for smooth, burr-free glue scraping.

• Anti-Deformation Design: Maintains blade shape under pressure.

Benefits

• Safely removes hardened adhesive from ICs, CPUs, and PCBs without damage.

• Helps reduce rework time with precise, controlled scraping.

• Ergonomic handle allows comfortable long-term use in repair stations.

• Compact and portable—ideal for on-site repair technicians.

• Improves workflow efficiency in professional refurbishing labs.

Applications

• IC/CPU glue and resin removal during motherboard rework.

• Adhesive cleaning for mobile phones, tablets, and PCB devices.

• Disassembling chipsets and logic boards without heat damage.

• Ideal for repair shops, refurbishing centers, and technician toolkits.

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