TE-720 Magnetic Silicone Tin Planting Pad | High-Temp CPU IC Soldering Mat

PKR 3000.00

Buy the TE-720 magnetic silicone tin planting pad for CPU and IC soldering. High-temperature resistant, with grooves (0.3–0.8 mm) and magnetic adsorption for stable chip repair and glue removal.

Overview

The TE-720 Tin Planting Pad is a magnetic silicone soldering work pad designed for CPU, IC, and BGA repair. Its heat-resistant silicone material and double-sided groove design (0.3–0.8 mm) make it ideal for chip glue removal, solder planting, and micro-soldering tasks. Strong magnetic adsorption keeps steel mesh and components firmly in place, making it a reliable tool for professional repair shops and DIY electronics technicians.

Key Features

• High-Temperature Resistant Silicone – Withstands soldering and hot air rework without warping.

• Magnetic Adsorption – Holds IC stencils and steel mesh firmly for stable tin planting.

• Four Groove Depths (0.3 / 0.4 / 0.7 / 0.8 mm) – Fits different chip sizes securely.

• Heat Dissipation Channels – Prevents overheating and solder bulging.

• Non-Slip Base – Stays firmly in place on your workstation.

Benefits

• Enhances precision during CPU & IC soldering.

• Reduces chip damage risk with stable heat resistance.

• Speeds up workflow for repair professionals.

• Durable and reusable, offering long-term value.

• Suitable for both mobile repair shops and DIY users.

Applications

• IC tin planting & reballing.

• CPU & NAND chip glue removal.

• Microsoldering support for phones, laptops, and tablets.

• SMT repair, DIY electronics, and lab use.

• TE-720 magnetic silicone tin planting pad

• high temperature CPU IC soldering mat

• chip glue removal silicone pad

• magnetic silicone tin planting pad 0.3–0.8mm

• BGA IC repair soldering pad