YCS 2S Hot Plate Rework Station – Mobile Phone Chip Preheat & Glue Removal Table

PKR 3500.00

Buy YCS 2S Chip Hot Plate Soldering Rework Station for mobile phone motherboard glue removal and IC preheating. Fast heating, precise control, and compact design.

Overview

The YCS 2S Chip Hot Plate Soldering Rework Station is a professional-grade preheating table designed for mobile phone motherboard glue removal and chip soldering rework. With rapid heating performance, uniform temperature distribution, and a durable build, it ensures safe and efficient IC repairs. Perfect for technicians, repair shops, and DIY repair enthusiasts, this compact station delivers consistent results for glue softening, preheating, and soldering tasks without damaging delicate components.

Key Features

• Rapid Heating Technology for fast operation and improved repair speed

• Even Heat Distribution to protect sensitive phone components

• Temperature Display for precise heat control

• Compact & Portable—easy to fit on small workbenches

• Durable Metal Build for long-lasting performance

• Specialized Design for motherboard glue removal and IC preheating

Benefits

• Increases repair efficiency by softening glue quickly

• Minimizes risk of damage to PCB and microchips

• Improves soldering results with stable preheating

• Easy to use—ideal for both beginners and professionals

• Saves space in busy repair workstations

Applications

• Glue Removal from mobile phone chips and IC components

• Preheating motherboards before soldering or desoldering

• Chip Rework for smartphones, tablets, and other electronics

• IC Replacement without damaging surrounding components