YCS SLd01 Shenlong Curved BGA Stencil Tin Planting Base – Universal Silicone Insulation Pad for Mobile CPU IC Soldering

PKR 800.00

Buy YCS Shenlong Universal Curved BGA Stencil Insulation Base – heat-resistant silicone pad for mobile CPU & IC soldering, tin planting, and BGA reballing.

Overview

The YCS Shenlong Universal Curved BGA Stencil Insulation Tin Planting Base is a premium repair tool designed for mobile phone CPU and IC soldering. Made from durable, heat-resistant silicone, it securely holds curved BGA stencils during tin planting, reballing, and chip soldering. Its universal fit supports multiple stencil sizes, making it an essential tool for mobile repair technicians who need precision, stability, and speed during delicate motherboard repairs.

Key Features

• Universal Curved Design – fits various BGA stencil sizes and chip shapes.

• Heat-Resistant Silicone – withstands high soldering temperatures without deformation.

• Non-Slip Insulation Base – keeps stencil steady for accurate tin planting.

• Lightweight & Portable – ideal for mobile repair benches and field work.

• High Precision Tool – perfect for CPU, GPU, and memory IC soldering.

Benefits

• Ensures Perfect Alignment – reduces errors during reballing and soldering.

• Improves Workflow Speed – faster stencil setup for higher repair efficiency.

• Protects Sensitive Components – insulation prevents heat damage to nearby parts.

• Cost-Effective Tool – reusable and built to last for long-term use.

• Professional Results – helps achieve clean, even tin planting every time.

Applications

• Mobile phone CPU reballing and IC soldering.

• Tin planting for BGA chips on iPhone, Samsung, Vivo, Oppo, and other brands.

• PCB repair work in electronics workshops.

• Ideal for technicians in BGA reballing, chip replacement, and motherboard repair.