0.6mm 50g YCS 63Sn 37Pb Solder Wire – Low Melting Point No-Clean BGA PCB Repair Repairing Materials

PKR 800.00

Buy 0.6mm 50g YCS 63Sn 37Pb Original Solder Wire for low melting point no-clean BGA PCB repair. Ideal for precise soldering, strong joints, and minimal residue.

Overview

The 0.6mm 50g YCS 63Sn 37Pb Original Solder Wire is a premium-quality low melting point, no-clean soldering wire designed for precision electronics work. Made with a eutectic alloy of 63% tin and 37% lead, it provides smooth solder flow, quick melting at 183°C, and strong, reliable joints. Perfect for BGA reballing, PCB repair, CPU soldering, and microelectronics projects, it ensures clean results without excessive residue.

Key Features

• Precision Diameter: 0.6mm for accurate and controlled soldering

• Eutectic Alloy: 63Sn/37Pb composition for stable performance

• Low Melting Point: Melts at just 183°C for faster work

• No-Clean Flux Core: Leaves minimal residue, reducing cleaning time

• 50g Spool: Ideal size for technicians and repair shops

• Consistent Quality: Smooth, bright, and strong solder joints

Benefits

• Saves time with quick-melting low-temp solder

• Reduces the risk of heat damage to components

• Delivers professional, clean, and durable solder joints

• Minimizes post-solder cleaning work

• Ideal for delicate PCB and BGA soldering tasks

Applications

• BGA chip reballing

• PCB assembly and repair

• CPU and GPU soldering

• Fine-pitch electronics components

• Smartphone, tablet, and laptop motherboard repair