YCS ARC BGA Silicone Pad – Magnetic Heat-Resistant Base for CPU Chip & BGA Reballing

PKR 1200.00

Buy YCS ARC BGA Silicone Pad with magnetic base—heat-resistant, non-slip, and universal for CPU chip soldering, BGA reballing, and motherboard repair.

Overview

The YCS ARC BGA Silicone Pad Insulation Mat is a premium, heat-resistant, and magnetic base designed for stable and precise BGA reballing, CPU chip soldering, and motherboard repairs. Its ARC design ensures better alignment for curved or complex stencil setups, while the silicone insulation layer protects delicate components from overheating during rework. This universal tool is ideal for mobile phone and PCB technicians seeking durability and accuracy in every repair session.

Key Features

• ARC-Shaped Design – Supports better stencil alignment for tricky reballing jobs.

• High-Temperature Silicone – Protects components from soldering heat damage.

• Magnetic Base – Securely holds BGA stencils and chips in place.

• Universal Fit – Compatible with multiple stencil sizes and IC chip types.

• Non-Slip Surface – Prevents movement during delicate soldering tasks.

Benefits

• Improved Precision – ARC design helps achieve perfect chip and stencil positioning.

• Faster Repairs – Magnetic hold reduces setup time and increases work efficiency.

• Component Safety – Insulation layer minimizes risk of overheating and damage.

• Long-Lasting Tool – Durable silicone withstands repeated high-heat use.

• Versatile Application – Works for mobile phone CPUs, PCBs, and various microchips.

Applications

• BGA reballing for mobile phone CPU and GPU chips.

• IC chip soldering and repair on PCB motherboards.

• Professional electronics repair workshops.

• DIY technicians needing reliable heat-resistant work surfaces.