JTX-138 Low temperature solder Paste

PKR 1100.00

JTX-138 50g solder paste with 138°C low melting point for precise BGA, IC, and PCB repair soldering applications.

Overview
The JTX-138 50g Low Temperature Solder Paste is a professional-grade soldering material formulated for dependable performance in electronics repair. With a low melting point of 138°C, this paste minimizes thermal stress on sensitive components, making it suitable for BGA chip reballing, IC soldering, and fine-pitch PCB repair tasks on smartphone motherboards and other delicate electronic assemblies. Its balanced formulation promotes strong wetting, bright solder joints, and smooth flow.

Key Features

• Low thermal melting point at ~138°C for reduced heat exposure to components.

• Designed for BGA/IC soldering and reballing.

• Moderate viscosity for stable paste distribution.

• Strong wettability and excellent joint formation.

• Clean appearance with low residue after reflow.

• Packaged in a 50g container for regular workshop use.

Benefits

• Reduces risk of overheating delicate mobile phone components.

• Helps achieve consistent, bright solder joints.

• Provides controlled reflow and smooth paste behavior.

• Suitable for use in both manual and reflow setups.

Applications

• BGA chip reballing and soldering.

• IC and component soldering on PCBs.

• Mobile phone motherboard repair.

• Patch and rework SMD components.

• Precision micro-soldering tasks requiring low heat.

Compatible Models
Applicable to a wide range of mobile devices and electronic boards requiring low-temperature soldering and fine-pitch component work.

FAQ Section

1. What is JTX-138 solder paste used for?
It is used for low-temperature soldering, especially in BGA reballing and fine component repair.

2. Why choose 138°C melting point?
The low melting point reduces thermal stress on sensitive components and helps prevent board damage.

3. Is it suitable for smartphone repair?
Yes, it is commonly used in mobile phone motherboard rework and IC soldering tasks.

4. Can it be used manually and with reflow?
Yes, it works for both manual application and reflow soldering workflows.

5. Does it leave a lot of residue?
The formula is designed for low residue, supporting cleaner rework results.