LW-SP1 138° HIGH QUALITY SOLDER PASTE

PKR 1200.00

LW-SP1 138°C BGA solder paste flux for ultra-low temperature IC soldering and reballing on sensitive smartphone motherboards and fine-pitch PCBs.

Overview
LW-SP1 138°C is a professional ultra-low temperature BGA solder paste flux designed for precise IC soldering and reballing on highly sensitive PCBs. Its very low melting point reduces heat stress on delicate components, allowing technicians to perform micro-soldering repairs safely and accurately while maintaining PCB integrity.

Key Features

• 138°C ultra-low melting point for heat-sensitive PCBs

• Suitable for BGA and SMT IC soldering

• Smooth paste consistency for precise application

• Designed for fine-pitch smartphone motherboards and electronics

• Stable performance with hot air rework and soldering stations

• Ideal for reballing, IC replacement, and delicate soldering tasks

Benefits

• Minimizes heat damage to PCBs and components

• Ensures consistent and reliable solder joints

• Reduces bridging and soldering errors on fine pads

• Enhances precision during IC placement and reflow

• Improves efficiency in delicate micro-soldering repairs

Applications

• Ultra-low temperature BGA IC soldering

• IC reballing and replacement on sensitive motherboards

• Fine-pitch SMT PCB repair

• Chipset and logic IC micro-soldering

• Repair of delicate electronics and micro-components

Compatible Models
Compatible with multiple smartphone motherboards and fine-pitch electronic PCBs requiring ultra-low temperature soldering.

FAQ Section

1. What does LW-SP1 138°C solder paste do?
It melts at 138°C to create low-temperature solder joints for BGA and IC components.

2. What common repair issues is it used for?
Delicate IC soldering, weak joints, and bridging problems.

3. Is it suitable for smartphone repairs?
Yes, particularly for sensitive motherboards and fine-pitch ICs.

4. What skill level is required to use it?
Technicians with basic to advanced micro-soldering experience can use it.

5. What repair outcome does it improve?
Safe, precise, and clean solder joints on heat-sensitive ICs and BGA chips.