2UUL BH17 CPU REBALL BASE Magnetic Dual-Sided Reballing Platform Set

PKR 15999.00

2UUL BH17 magnetic dual-sided reballing platform for CPU and BGA solder ball alignment in smartphone motherboard repair.

Overview

The 2UUL BH17 CPU REBALL BASE is a magnetic dual-sided reballing platform designed for precise CPU and BGA rework in smartphone motherboard repair. It provides stable positioning of chips and stencils during solder ball placement and heating. The magnetic base enhances alignment accuracy and minimizes movement during the reballing process.

Key Features

• Dual-sided reballing platform design

• Integrated magnetic positioning system

• Designed for CPU and BGA reballing

• Stable base structure for heat processes

• Supports stencil alignment and chip fixation

• Suitable for professional micro-soldering environments

Benefits

• Improves chip stability during solder ball placement

• Reduces misalignment during heating

• Supports uniform solder ball distribution

• Enhances precision in CPU reball procedures

• Suitable for repetitive professional repair use

Applications

• CPU reballing

• BGA solder ball replacement

• Smartphone motherboard repair

• IC rework and restoration

• Controlled hot air reballing processes

Compatible Models

Compatible with multiple smartphone models and general electronics repair.

FAQ Section

1. What does the 2UUL BH17 reball base do?
It holds CPUs and BGA chips securely during solder ball placement and heating.

2. When do technicians use this platform?
It is used during CPU and BGA reballing in motherboard repair.

3. Is it compatible with different chip sizes?
It supports various CPU and BGA chips used in smartphone repair.

4. Does it require advanced skills?
Yes, CPU reballing requires professional micro-soldering experience.

5. How does it improve repair results?
It enhances alignment accuracy and stability, reducing solder defects and rework.