CD3217 Reballing Stencil Precision BGA Stencil for Apple USB-C Controller IC Repair

PKR 1000.00

Buy CD3217 Reballing Stencil for Apple motherboard repair. High-precision stainless steel BGA stencil designed for CD3217 USB-C controller IC reballing. Durable, heat-resistant, and perfect for chip-level repair technicians.

Overview

The CD3217 Stencil is a precision-engineered reballing stencil designed for repairing and reballing the CD3217 USB-C controller IC commonly used in modern Apple devices. Built with high-quality stainless steel, it ensures accurate ball alignment, uniform heating, and seamless chip-level repairs for professional technicians.

Key Features

• High-precision BGA grid for CD3217 chip

• Stainless steel, durable, and heat-resistant

• Perfect ball alignment for accurate reballing

• Optimized thickness for even heating

• Warp-resistant and long-lasting

• Ideal for Apple motherboard repairs

Benefits

• Helps achieve clean and professional reballing results

• Reduces risk of IC misalignment

• Saves time during chip-level repairs

• Ensures consistent solder ball placement

• Provides stable performance for repeated use

Applications

• CD3217 USB-C controller IC reballing

• Apple MacBook & iPad motherboard repair

• BGA chip soldering and reworking

• Service centers and chip-level repair labs

FAQ Section

Q1: Which IC does this stencil support?

This stencil is specifically designed for the CD3217 USB-C controller IC.

Q2: Can it be used on any Apple logic board?

Yes, it is suitable for reballing CD3217 chips used in many MacBook and iPad models.

Q3: Is the stencil heat-resistant?

Yes, it is made from high-grade stainless steel to withstand rework station temperatures.

Q4: Does it support repeated use?

Absolutely — the durable material ensures long-term reliability.

Q5: Is it suitable for beginners?

Yes, but best results are achieved with some experience in BGA reballing.