AMAOE M10 183°C & M11 138°C Solder Paste

PKR 1150.00

AMAOE M10 183°C and M11 138°C solder paste for PCB, IC, and BGA soldering, supporting precise reflow and stable joints in electronics repair.

Overview

The AMAOE M10 183°C & M11 138°C Solder Paste set provides two controlled melting-point options for professional electronics and mobile phone repair. Formulated with integrated flux, these solder pastes improve wetting, reduce oxidation, and support consistent solder joint formation on PCB pads, IC pins, and BGA layouts. The higher-temperature M10 is suitable for standard soldering and structural joints, while the low-temperature M11 is designed for heat-sensitive components and precision rework.

Key Features

• Two melting points for different repair requirements

• M10: 183°C for standard and durable solder joints

• M11: 138°C for low-temperature and sensitive components

• Integrated flux for improved wetting and oxide removal

• Smooth consistency for even solder distribution

• Suitable for hot air, reflow, and manual soldering processes

Benefits

• Allows temperature-matched soldering for different components

• Reduces thermal stress on sensitive ICs and PCB layers

• Improves solder flow and joint stability

• Supports clean, accurate solder placement

• Reliable results in professional repair environments

Applications

• Mobile phone motherboard repair

• BGA reballing and IC replacement

• SMD component soldering and rework

• Connector and pad restoration

• Precision electronics soldering tasks

Compatible Models

Compatible with multiple smartphone models and general electronics PCBs.

FAQ Section

1. What does this solder paste do?
It enables controlled soldering and reflow of PCB pads, ICs, and BGA components.

2. When should I use M10 vs M11?
Use M10 for standard soldering and M11 for low-temperature work on heat-sensitive components.

3. Is this suitable for BGA reballing?
Yes, both variants support BGA soldering and reballing processes.

4. What skill level is required to use it?
Basic to advanced electronics repair knowledge is recommended.

5. What repair outcome can be expected?
Stable solder joints with improved wetting and reduced rework risk.