LW-322 High density nano cleaning sponge

PKR 600.00

LUOWEI LW-322 high density nano cleaning sponge for PCB, motherboard, and smartphone repair cleaning applications.

Overview
The LUOWEI LW-322 High-Density Nano Cleaning Sponge is a professional cleaning accessory designed for mobile phone and electronics repair. It is used to remove flux residue, oxidation, and light contamination from PCBs and components without damaging pads or traces, supporting clean and reliable repair work.

Key Features

• High-density nano sponge material

• Designed for PCB and motherboard cleaning

• Suitable for removing flux residue and oxidation

• Non-abrasive surface for delicate components

• Compact size for precision cleaning

• Compatible with standard repair workflows

Benefits

• Helps achieve cleaner PCB surfaces

• Reduces risk of pad or trace damage

• Improves inspection and rework accuracy

• Supports reliable soldering results

• Suitable for daily professional use

Applications

• Smartphone motherboard cleaning

• PCB cleaning after soldering or rework

• Flux and residue removal

• Electronics repair and maintenance

• Precision cleaning during device repair

FAQ Section

1. What is the LUOWEI LW-322 nano sponge used for?
It is used to clean PCBs and components during electronics repair.

2. What common issues does it help solve?
Flux residue, light oxidation, and surface contamination.

3. Is it safe for smartphone motherboards?
Yes, it is designed for delicate PCB and component cleaning.

4. Does it require special skills to use?
No, it is easy to use with basic repair experience.

5. What repair outcome does it support?
Cleaner boards and improved soldering and inspection results.