PPD tools Mobile Phone Repair Double-Headed Brush Bristle & Superfine Steel Dual-Use Tool for IC Pads & Glue Removal Cleaning Tools

PKR 600.00

Upgrade your repair toolkit with our Mobile Phone Repair Double-Headed Brush. Featuring bristle and superfine steel heads, it’s perfect for cleaning IC pads and removing glue residues. Shop now for precision cleaning tools.

Overview

The Mobile Phone Repair Double-Headed Dual-Use Hard Brush is an essential tool designed for precise and effective cleaning in mobile phone repairs. Featuring both a bristle head and a superfine steel head, this brush is specifically engineered to tackle different cleaning tasks on mobile phone IC pads, motherboards, and other delicate components.

Key Features

1.      Dual-Head Design

• Bristle Head: Made with durable, high-quality bristles, this head is ideal for removing dust, debris, and loose particles from IC pads and other sensitive areas without causing damage.
• Superfine Steel Head: The superfine steel bristles are perfect for more intensive cleaning tasks, such as removing stubborn glue residues and other contaminants from motherboards.

2.      Versatile Cleaning

• IC Pad Cleaning: The bristle head is gentle enough to clean the delicate surfaces of IC pads, ensuring that no debris or contaminants interfere with the functionality of the components.
• Glue Removal: The superfine steel head is highly effective for scraping away adhesive residues and glue from motherboards and other electronic surfaces.

3.      Precision and Control

• Ergonomic Handle: Designed for ease of use, the brush features an ergonomic handle that provides a comfortable grip and precise control during cleaning.
• Compact and Portable: Its compact size makes it easy to handle and store, making it a convenient addition to any mobile phone repair toolkit.

4.      Durability

• High-Quality Materials: Constructed from robust materials, both the bristle and steel heads are designed to withstand frequent use and provide long-lasting performance.

How to Use

1.      Select the Appropriate Head:

• For IC pad cleaning, use the bristle head to gently sweep away dust and debris.
• For glue removal, switch to the superfine steel head to carefully scrape off adhesive residues.

2.      Apply Gentle Pressure:

• When using the bristle head, apply light pressure to avoid damaging sensitive components.
• When using the steel head, use controlled pressure to effectively remove glue without scratching or damaging the motherboard.

3.      Clean the Brush Regularly:

• After use, clean the brush to remove any accumulated debris or glue residues. This ensures optimal performance and prolongs the lifespan of the tool.

Benefits

• Enhanced Cleaning Efficiency: The dual-head design provides versatility, allowing you to tackle various cleaning tasks with a single tool.
• Improved Repair Quality: By maintaining clean IC pads and removing adhesive residues, you ensure better connectivity and functionality of repaired components.
• Convenience: The brush's compact design and dual-use functionality make it a practical addition to any mobile phone repair kit.

Buy Now, Learn more or have a question about our Double-Headed Brush  Bristle & Superfine Steel Dual-Use Tool for IC Pads & Glue Removal, or contact us for assistance @ BilalGsm