PPD tools JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 15 Pro Max PCB Holder

PKR 12000.00

The JTX SM-01 BGA Reballing Stencil Platform Set is designed for iPhone 8 to 15 Pro Max repairs. Includes precision stencils and a durable platform for accurate and efficient reballing of BGA chips.

Overview

The JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set is a comprehensive solution for professional technicians and DIY enthusiasts working with BGA (Ball Grid Array) chip reballing and repair. Designed specifically for iPhone models from the iPhone 8 to the iPhone 15 Pro Max, this stencil platform set provides precise alignment and efficient reballing, making it a crucial tool for maintaining and repairing modern smartphones.

Key Features

1.      Universal Compatibility

• Wide Range of Models: The JTX SM-01 set is designed to support a broad spectrum of iPhone models, from the iPhone 8 to the iPhone 15 Pro Max. This makes it a versatile choice for various repair scenarios.
• Precision Stencils: Includes multiple stencils tailored to different BGA chips and board sizes, ensuring precise and accurate reballing for various components.

2.      High-Quality Materials

• Durable Construction: Made from high-quality, heat-resistant materials that ensure long-lasting performance and withstand the demands of frequent reballing tasks.
• Accurate Design: Precision-engineered stencils and platforms for consistent alignment and high-quality results.

3.      User-Friendly Design

• Easy to Use: Features an intuitive design that simplifies the reballing process, making it accessible for both novice technicians and experienced professionals.
• Efficient Workflow: Streamlined setup and operation help to improve efficiency and reduce the time required for each repair.

4.      Enhanced Repair Accuracy

• Precise Alignment: The stencil platform set ensures accurate alignment of BGA chips, which is crucial for effective soldering and reliable component performance.
• Consistent Results: Facilitates consistent and high-quality reballing results, reducing the likelihood of errors and improving overall repair quality.

5.      Comprehensive Set

• Variety of Stencils: Includes a range of stencils to cover different chip sizes and configurations, providing flexibility for various repair needs.
• Complete Platform Set: Comes with all necessary components to perform effective BGA reballing, making it a complete solution for iPhone repairs.

How to Use the JTX SM-01 Reballing Stencil Platform Set

1.      Setup

• Prepare Work Area: Ensure that your workspace is clean and well-lit. Place the JTX SM-01 stencil platform on a stable surface.
• Select Stencil: Choose the appropriate stencil for the BGA chip you are working with, ensuring it matches the component and board size.

2.      Position the Board

• Secure the Board: Place the iPhone motherboard onto the platform and align it with the selected stencil. Ensure it is securely held in place.
• Align the Stencil: Position the stencil over the BGA chip area, ensuring accurate alignment with the chip pads.

3.      Reballing Process

• Apply Solder Balls: Use solder balls and flux to perform the reballing process according to the stencil design.
• Reflow Solder: Heat the board and solder balls to reflow the solder and create a reliable connection.

4.      Complete the Repair

• Inspect Work: After reballing, inspect the BGA chip and solder joints to ensure proper placement and soldering.
• Clean and Test: Clean any residual flux and test the repaired board to ensure functionality.

5.      Store Components

• Clean Stencils: Wipe down and clean the stencils and platform to remove any solder residue or debris.
• Store Properly: Store the stencil platform set in a safe place to maintain its condition and ensure longevity.

Benefits

• Enhanced Accuracy: Provides precise alignment and consistent results, leading to higher-quality repairs and fewer errors.
• Versatility: Supports a wide range of iPhone models and BGA chip sizes, making it a flexible tool for various repair tasks.
• Efficiency: Streamlines the reballing process, reducing repair time and improving overall workflow.

Buy Now, Learn more or have a question about our JTX SM-01 Swap Board Chips BGA Reballing Stencil Platform Set for iPhone 8 to 15 Pro Max, or contact us for assistance @ BilalGsm